US Patent Issued to Kokusai Electric on April 22 for "Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,478, issued on April 22, was assigned to Kokusai Electric Corp. (Tokyo).

"Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium" was invented by Yoshitomo Hashimoto (Toyama, Japan), Kimihiko Nakatani (Toyama, Japan) and Takayuki Waseda (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: (a) forming an inhibitor layer on a surface of a first material of a concave portion provided on a surface of a substrate, by supplying a precursor to the substrate to adsorb at least a portion of a molecular structure of molecules constituting the precursor on...