ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,108, issued on April 15, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing method, method of manufacturing semiconductor device, non- transitory computer-readable recording medium and substrate processing apparatus" was invented by Arito Ogawa (Toyama, Japan) and Kota Kowa (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of forming a sufficiently flat film. According to one aspect of the technique, there is provided a substrate processing method including: forming a metal-containing multi-layer film structure on a substrate by alternately performing: (a) forming a metal-containing...