ALEXANDRIA, Va., June 5 -- United States Patent no. D1,070,797, issued on April 15, was assigned to Kokusai Electric Corp. (Tokyo).
"Furnace for substrate processing apparatus" was invented by Hideto Tateno (Toyama, Japan), Takatomo Yamaguchi (Toyama, Japan) and Daiki Kimoto (Toyama, Japan).
The patent was filed on Aug. 8, 2022, under Application No. D/849,023.
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