US Patent Issued to Kokusai Electric on April 1 for "Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,522, issued on April 1, was assigned to Kokusai Electric Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium" was invented by Kazuyuki Okuda (Toyama, Japan), Syuzo Sakurai (Toyama, Japan), Yasuhiro Inokuchi (Toyama, Japan) and Masayoshi Minami (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described herein is a technique capable of improving the controllability of firm thickness distribution. According to one aspect of the technique, there is provided a substrate processing apparatus including: a process chamber; a first and a second gas sup...