ALEXANDRIA, Va., March 19 -- United States Patent no. 12,251,864, issued on March 18, was assigned to KOITO MANUFACTURING Co. LTD. (Tokyo).
"Mold device and injection molding method" was invented by Tsukasa Ishiwata (Shizuoka, Japan), Noriyuki Nakajima (Shizuoka, Japan), Jyunya Sano (Shizuoka, Japan) and Hiroya Ito (Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mold device includes a primary mold and a secondary mold. The primary mold includes a cavity mold and a primary core mold. The primary mold is configured to inject a first resin material into a first cavity to mold a primary molded product, the first cavity being formed by clamping the cavity mold and the primary core mold. The seco...