US Patent Issued to KOBELCO RESEARCH INSTITUTE on Feb. 3 for "Wafer thickness measurement device and method for same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,813, issued on Feb. 3, was assigned to KOBELCO RESEARCH INSTITUTE INC. (Kobe, Japan).

"Wafer thickness measurement device and method for same" was invented by Kazuhiko Tahara (Kobe, Japan) and Ryo Usaki (Kobe, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer thickness measurement device of the present invention obtains, based on: first and second interferometer reference measurement results obtained by measuring, with an A-surface optical interferometer and a B-surface optical interferometer, a reference measurement point on a reference piece having the reference measurement point at which the reference piece has a known thickness; first ...