US Patent Issued to KOBAYASHI & Co. on May 6 for "Combination of mold and release film, release film, mold, and method for manufacturing molded article" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,290,967, issued on May 6, was assigned to KOBAYASHI & Co. LTD. (Tokyo).

"Combination of mold and release film, release film, mold, and method for manufacturing molded article" was invented by Keisuke Sakai (Matsudo, Japan), Nanae Tanaka (Matsudo, Japan), Kenji Miyashita (Tokyo) and Go Kobayashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the invention is to provide a method for conditioning a surface of a molded article. The present invention relates to a combination of a mold used for curing a thermosetting resin and a release film placed between the thermosetting resin and the mold during the curing. The release film comprises a...