US Patent Issued to Knauf Gips on Sept. 16 for "Board with fiber-reinforced dense layer" (Illinois, Maryland, Indiana Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,765, issued on Sept. 16, was assigned to Knauf Gips KG (Iphofen, Germany).

"Board with fiber-reinforced dense layer" was invented by Annamaria Vilinska (Chicago), Mark K. Hemphill (Hawthorn Woods, Ill.), Yijun Sang (Oak Park, Ill.), Nicholas S. Jones (Valparaiso, Ind.), Kevern O. Fraser (Bowie, Md.), Jon Cross (Westfield, Ind.) and Te Hua Lau (Glenview, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a composite gypsum board comprising a set gypsum core disposed between face (e.g., Manila) and back (e.g., Newsline) cover sheets. The set gypsum core is formed from a core slurry comprising stucco, water, and optional additives, such ...