ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,352, issued on Oct. 21, was assigned to KLA Corp. (Milpitas, Calif.).

"Optics for measurement of thick films and high aspect ratio structures" was invented by David Y. Wang (Santa Clara, Calif.) and Shankar Krishnan (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for performing spectroscopic ellipsometry measurements of semiconductor structures with reflective collection relay optics having demagnification from the spectrometer slit to the detector are presented herein. The demagnification effectively increases the NA at the detector and reduces the measurement spot size at the wafer imaged onto the detector. In...