US Patent Issued to KLA on Nov. 4 for "Measurement of thick films and high aspect ratio structures" (California Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,461,041, issued on Nov. 4, was assigned to KLA Corp. (Milpitas, Calif.).

"Measurement of thick films and high aspect ratio structures" was invented by David Y. Wang (Santa Clara, Calif.) and Shankar Krishnan (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The system includes a light source configured to emit light along an illumination path; a projection optical assembly disposed in the illumination path; a target disposed in the illumination path and configured to reflect the light along a collection path; a collection optical assembly disposed in the collection path; a detector disposed in the collection path and configured to detect ...