US Patent Issued to KLA on Nov. 25 for "System and method for optimizing through silicon via overlay" (Belgian, American Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,223, issued on Nov. 25, was assigned to KLA Corp. (Milpitas, Calif.).

"System and method for optimizing through silicon via overlay" was invented by Franz Zach (Los Gatos, Calif.), Mark D. Smith (San Jose, Calif.) and Roel Gronheid (Leuven, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer shape metrology system includes a wafer shape metrology sub-system configured to perform stress-free shape measurements on an active wafer, a carrier wafer, and a bonded device wafer. The active wafer includes functioning logic circuitry and the carrier wafer is electrically passive. The wafer shape metrology system includes a controller communicative...