ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,581, issued on July 29, was assigned to KLA Corp. (Milpitas, Calif.).
"In-situ process chamber chuck cleaning by cleaning substrate" was invented by Mor Azaria (Migdal Ha'emek, Israel), Giampietro Bieli (Santa Clara, Calif.), Shai Mark (Kibutz Snir, Israel), Adi Pahima (Migdal Ha'emek, Israel) and Yoram Uziel (Migdal Ha'emek, Israel).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostati...