US Patent Issued to KLA on Feb. 10 for "Calibration of parametric measurement models based on in-line wafer measurement data" (Chinese, Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,727, issued on Feb. 10, was assigned to KLA Corp. (Milpitas, Calif.).

"Calibration of parametric measurement models based on in-line wafer measurement data" was invented by Brian C. Lin (Zhubei, Taiwan), David Wu (Zhubei, Taiwan), Song Wu (Shanghai), Tianrong Zhan (Shanghai), Emily Chiu (Zhubei, Taiwan) and Andrew Lagodzinski (Livermore, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for calibrating simulated measurement signals generated by a parametric measurement model are described herein. Regression on real measurement signals is performed using a parametric model. The residual fitting error between the real measureme...