US Patent Issued to KLA on Aug. 12 for "Wafer signature local maxima via clustering for metrology guided inspection" (American, Indian Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,387,310, issued on Aug. 12, was assigned to KLA Corp. (Milpitas, Calif.).

"Wafer signature local maxima via clustering for metrology guided inspection" was invented by Alan Davila (El Paso, Texas), Marcus Liesching (Boulder Creek, Calif.), Sandeep Bhagwat (Milpitas, Calif.), Surya Vanamali (San Jose, Calif.), Suresh Selvaraj (Fremont, Calif.), Sravani Desu (Andhra Pradesh, India), Ganesh Meenakshisundaram (Austin, Texas), Karthik Purushothaman (Chennai, India) and Ardis Liang (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and systems for generating information for use in setting up a process performed on a specimen are provid...