ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,439, issued on Sept. 30, was assigned to KIOXIA Corp. (Tokyo).
"Semiconductor package and semiconductor device" was invented by Ryujiro Bando (Inagi, Japan) and Hitoshi Ikei (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring subst...