ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,451, issued on Sept. 30, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor device" was invented by Nobuaki Okada (Kawasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a device includes a first chip including a first via in a first surface; and a second chip including a second via in a second surface and overlapping the first chip in a direction perpendicular to the first surface. The first via includes a first side along a second direction parallel to the first surface, and a second side along a third direction parallel to the first surface, the second via includes a third side along the third direction and...