US Patent Issued to KIOXIA on Sept. 16 for "Semiconductor device and semiconductor device manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,047, issued on Sept. 16, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor device and semiconductor device manufacturing method" was invented by Yasuo Takemoto (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a substrate; a first semiconductor chip; a first adhesive layer; a second semiconductor chip; a second adhesive layer; and a spacer. The substrate has a first surface. The first semiconductor chip is provided above the first surface. The first adhesive layer is provided on a lower surface, which is opposed to the substrate, of the first semiconductor chip and contains a plurality of types of r...