US Patent Issued to Kioxia on Oct. 28 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,710, issued on Oct. 28, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor device" was invented by Satoru Itakura (Machida Tokyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a wiring board having a surface; a chip stack disposed above the surface and including a first semiconductor chip; a second semiconductor chip disposed between the surface and the chip stack; a spacer disposed between the surface and the first semiconductor chip, the spacer surrounding the second semiconductor chip along the surface, and the spacer containing a material higher in thermal conductivity than silicon; and a sealing insulat...