ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,711, issued on Oct. 14, was assigned to KIOXIA Corp..
"Semiconductor device and method for manufacturing same" was invented by Masayuki Miura (Ota Tokyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first stacked body provided above a substrate, and including a plurality of first semiconductor chips stacked on top of one another; and a second stacked body provided further above the first stacked body, and including a plurality of second semiconductor chips stacked on top of one another. The first semiconductor chips each have a first pad facing toward the substrate, and the second semiconductor chips each ha...