ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,075, issued on Nov. 4, was assigned to KIOXIA Corp. (Tokyo).
"Semiconductor manufacturing device" was invented by Yasuhide Okada (Yokkaichi Mie, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing device includes: a turntable configured to be rotatable and having a first surface; a polishing pad provided on the first surface; a first support portion configured to rotatably hold the turntable; a top ring having a second surface and including a suction mechanism that holds an object to be processed on the second surface; a second support portion configured to rotatably hold the top ring; a first member to come into contac...