US Patent Issued to Kioxia on Nov. 25 for "Semiconductor manufacturing apparatus and method of manufacturing semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,669, issued on Nov. 25, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor manufacturing apparatus and method of manufacturing semiconductor device" was invented by Takashi Watanabe (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor manufacturing apparatus is a semiconductor manufacturing apparatus for holding a polishing object on a polishing head and polishing a surface of the polishing object. The semiconductor manufacturing apparatus includes a plurality of laser irradiation parts on the polishing head. At least one of the laser irradiation parts is a laser irradiation part configured to radiate a laser beam t...