ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,467,945, issued on Nov. 11, was assigned to Kioxia Corp. (Tokyo).
"Test board and method for testing semiconductor device" was invented by Hideaki Murakami (Saitama Saitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A test board includes a substrate, a socket mounted on the substrate and including a first connector pin to be connected to a first terminal of a semiconductor device when the semiconductor device is mounted in the socket, a plurality of external terminals through which a voltage or a signal is supplied to the first connector, first and second current paths that can be electrically connected between the first connector pin and one...