US Patent Issued to Kioxia on May 27 for "Wiring board, semiconductor device, and method of manufacturing wiring board" (Japanese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,416, issued on May 27, was assigned to Kioxia Corp. (Tokyo).

"Wiring board, semiconductor device, and method of manufacturing wiring board" was invented by Tomonori Kawata (Kawasaki Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes: a first insulating layer; a first pad region provided above the first insulating layer and having a first connection pad; a second insulating layer provided above the first connection pad and having a first opening to expose the first connection pad; a second pad region provided above the second insulating layer and having a second connection pad electrically connected to the first co...