US Patent Issued to Kioxia on May 27 for "Semiconductor memory device having a contact plug electrically connected to an interconnection through a narrower via" (Japanese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,500, issued on May 27, was assigned to Kioxia Corp. (Minato-ku, Japan).

"Semiconductor memory device having a contact plug electrically connected to an interconnection through a narrower via" was invented by Yoshiaki Fukuzumi (Yokkaichi, Japan) and Hideaki Aochi (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. The circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control...