US Patent Issued to KIOXIA on May 13 for "Film processing method and semiconductor device manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,504, issued on May 13, was assigned to KIOXIA Corp. (Tokyo).

"Film processing method and semiconductor device manufacturing method" was invented by Junichi Hashimoto (Yokkaichi Mie, Japan), Mitsuhiro Omura (Nagoya Aichi, Japan) and Toshiyuki Sasaki (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film processing method includes forming a target film, the target film having an upper surface. The method includes forming a carbon film on the upper surface of the target film. The method includes performing a first etching to format least one recess in the target film, with the carbon film serving as a mask. The method includes perf...