ALEXANDRIA, Va., June 4 -- United States Patent no. 12,318,888, issued on June 3, was assigned to Kioxia Corp. (Tokyo).
"Polishing apparatus and polishing method" was invented by Takeshi Kikuchi (Yokkaichi Mie, Japan), Takayuki Nakayama (Yokkaichi Mie, Japan), Masayoshi Adachi (Yokkaichi Mie, Japan) and Daisuke Sugiyama (Yokkaichi Mie, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing apparatus is configured to polish a peripheral edge of an object. The apparatus includes: a stage having a mounting surface to mount the object; a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge; a first inlet configured to supply liquid to the pol...