ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,087, issued on June 24, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor package and semiconductor device" was invented by Takuya Okishima (Yokohama Kanagawa, Japan) and Keiichi Akama (Yokohama Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged semiconductor device includes a wiring substrate with a bonding pad on a first surface, a wiring layer, a first conductive plug extending through the wiring substrate from the wiring layer to the first surface, a second conductive plug extending through the wiring substrate from the wiring layer to a second surface, and a third conductive plug extending through the wiring substrate ...