US Patent Issued to Kioxia on June 24 for "Method for manufacturing semiconductor device including resin layers" (Japanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,024, issued on June 24, was assigned to Kioxia Corp. (Tokyo).

"Method for manufacturing semiconductor device including resin layers" was invented by Eiji Takano (Nagoya Aichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a method for manufacturing a semiconductor device includes placing a semiconductor chip on a first surface of a support substrate, forming a first resin layer covering the semiconductor chip on the first surface, and forming a second resin layer on a second surface of the support substrate. The second surface is opposite the first surface. In some examples, the second resin layer can be formed to...