ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,999, issued on July 8, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor device and method of manufacturing the same" was invented by Masayuki Miura (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a wiring substrate in which a wiring layer is provided; a first semiconductor chip that is provided above the wiring substrate and on a surface of which a first pad is formed, the surface being on a side closer to the wiring substrate; a second semiconductor chip that is provided on the first semiconductor chip through a first resin layer and on a surface of which a second pad is formed, the surface being on a side ...