ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,972, issued on July 8, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor device" was invented by Naoyuki Kondo (Kamakura, Japan), Tsutomu Takahashi (Kawasaki, Japan), Shinichi Maruyama (Yokohama, Japan), Hiromitsu Harashima (Yokohama, Japan), Yuuichi Tatsumi (Setagaya, Japan) and Yoshiko Kato (Yokohama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to an embodiment includes a semiconductor chip, a semiconductor element, a stacked body, and a structure body. The semiconductor chip includes a first surface, a second surface, and a side surface between the first surface and the second surface. The semiconductor...