US Patent Issued to KIOXIA on July 8 for "Method for manufacturing indium-containing organic polymer film, patterning method, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,353,131, issued on July 8, was assigned to KIOXIA Corp. (Tokyo).

"Method for manufacturing indium-containing organic polymer film, patterning method, and method for manufacturing semiconductor device" was invented by Koji Asakawa (Kanagawa, Japan), Norikatsu Sasao (Kanagawa, Japan) and Shinobu Sugimura (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing an indium-containing organic polymer film includes forming an organic polymer film on a base body, infiltrating the organic polymer film with an alkylindium having an alkyl group having 2 to 4 carbon atoms, and oxidizing the organic polymer film infiltrated with the ...