ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,594, issued on July 29, was assigned to KIOXIA Corp. (Tokyo).
"Semiconductor device and electronic device" was invented by Hideki Takahashi (Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, a semiconductor chip, a resin, and a terminal. The substrate spreads along a first surface. The semiconductor chip is provided above the substrate in a first direction. The resin covers the semiconductor chip. The terminal is provided below the substrate in the first direction. The resin includes a first portion and a second portion. A height of the first portion in the first direction is higher than a he...