ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,300, issued on July 29, was assigned to KIOXIA Corp. (Tokyo).
"Method for manufacturing semiconductor device and method for processing film" was invented by Kazunori Zaima (Mie, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device includes forming a first film on a substrate, forming a second film on the first film, and forming a second recessed portion in the second film. The method further includes forming a third film on a side surface of the second film in the second recessed portion, and processing the second or third film in the second recessed portion. The method further includes processing th...