ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,513, issued on July 1, was assigned to KIOXIA Corp. (Tokyo).
"Semiconductor memory device" was invented by Keita Hasegawa (Yokkaichi Mie, Japan) and Keisuke Nakatsuka (Kobe Hyogo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor memory device includes a first chip, a second chip, and a multiple of bonding pads. The first chip has a multiple of memory pillars that penetrate a multiple of wiring layers in a first direction. The second chip is bonded to the first chip. The multiple of bonding pads are provided at a bonding face between the first chip and the second chip. The multiple of bonding pads include a first bonding pad that e...