US Patent Issued to Kioxia on Jan. 28 for "Semiconductor memory device having memory chip bonded to a CMOS chip including a peripheral circuit" (Japanese Inventor)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,544, issued on Jan. 28, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor memory device having memory chip bonded to a CMOS chip including a peripheral circuit" was invented by Hiroshi Maejima (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory device includes a first memory cell provided above a substrate; a first bit line coupled to the first memory cell and extending in a first direction; a first sense amplifier configured to sense a voltage of the first bit line; a second memory cell provided above the substrate; a second bit line adjacent to the first bit line and extending in the first direction, the second bit line being coupled...