US Patent Issued to Kioxia on Jan. 20 for "Substrate processing method and substrate processing device" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,696, issued on Jan. 20, was assigned to Kioxia Corp. (Tokyo).

"Substrate processing method and substrate processing device" was invented by Mana Tanabe (Tokyo), Kaori Umezawa (Fujisawa Kanagawa, Japan) and Kosuke Takai (Yokohama Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment, a substrate processing method includes forming a liquid film on a substrate including a first region provided with a first film on an outermost surface thereof and a second region provided with a second film on an outermost surface thereof, the first film and the second film being different from each other in material. The method furth...