ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,577, issued on Jan. 13, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor device and manufacturing method" was invented by Soichi Homma (Yokkaichi Mie, Japan) and Chikara Miyazaki (Yokkaichi Mie, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device of an embodiment includes: a first semiconductor element; a first insulating resin that seals the first semiconductor element; a wiring substrate having a pad; a first wiring that extends from the first semiconductor element toward the wiring substrate, and has a first head portion and a first column portion, the first column portion connected to the first semiconductor element a...