US Patent Issued to Kioxia on Feb. 3 for "Semiconductor device and semiconductor device manufacturing method" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,591, issued on Feb. 3, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor device and semiconductor device manufacturing method" was invented by Satoru Itakura (Machida Tokyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a semiconductor device includes: a circuit board; a first semiconductor chip mounted on a face of the circuit board; a resin film covering the first semiconductor chip; and a second semiconductor chip having a chip area larger than a chip area of the first semiconductor chip, the second semiconductor chip being stuck to an upper face of the resin film and mounted on the circuit board. The resin f...