US Patent Issued to Kioxia on Feb. 25 for "Semiconductor device having plural stacked first chips sealed in a sealing portion and a second chip disposed in a recess provided in the sealing portion" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,315, issued on Feb. 25, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor device having plural stacked first chips sealed in a sealing portion and a second chip disposed in a recess provided in the sealing portion" was invented by Takayuki Ide (Yokkaichi Mie, Japan) and Kazuhiro Kato (Mie Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, there is provided a semiconductor device including a support, multiple first chips, a first sealing portion, a second chip, multiple first terminals and a second terminal. The multiple first chips are stacked on the support. The first sealing portion seals multiple first chips...