US Patent Issued to Kioxia on Feb. 18 for "Compound, polymer, pattern forming material, pattern forming method, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,228,860, issued on Feb. 18, was assigned to Kioxia Corp. (Tokyo).

"Compound, polymer, pattern forming material, pattern forming method, and method of manufacturing semiconductor device" was invented by Norikatsu Sasao (Kawasaki Kanagawa, Japan), Koji Asakawa (Kawasaki Kanagawa, Japan) and Shinobu Sugimura (Yokohama Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pattern forming material used for forming an organic film on a film to be processed of a substrate having the film to be processed, the organic film being patterned and then impregnated with a metallic compound to form a composite film which is used as a mask pattern when proces...