ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,254, issued on Feb. 10, was assigned to KIOXIA Corp. (Tokyo).
"Wiring substrate" was invented by Motoshi Seto (Nishitama, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the ...