ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,086, issued on Dec. 2, was assigned to KIOXIA Corp. (Tokyo).
"Semiconductor device" was invented by Masayuki Miura (Ota Tokyo, Japan), Kazuma Hasegawa (Kamakura Kanagawa, Japan) and Kazushige Kawasaki (Kawasaki Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a wiring substrate inside which a wiring layer is provided, a plurality of first semiconductor chips stacked in a shifted manner on the wiring substrate and each provided with a connection terminal on a surface facing the wiring substrate, and a second semiconductor chip having a function different from functions of the first semiconductor chips and ...