ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,202, issued on Dec. 16, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor device and manufacturing method thereof" was invented by Kazuma Hasegawa (Kamakura Kanagawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device according to an embodiment includes a substrate, a first semiconductor chip, a second semiconductor chip, a first wire and a second wire. The substrate includes a first surface. The first semiconductor chip is provided on the first surface. The second semiconductor chip is provided at a position on the first surface that is apart from a position of the first semiconductor chip in a first direction. The first...