ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,183, issued on Aug. 5, was assigned to Kioxia Corp. (Tokyo).
"Semiconductor device having stacked chips" was invented by Masaru Koyanagi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes first, second and third stacked chips with a first, second and third substrate, respectively, at least three first, second and third logical circuits, respectively, and at least two first, second and third vias, respectively, and a fourth chip stacked on the third chip having a fourth substrate, and at least three fourth logical circuits. First and second ones of the first to third logical circuits of the first to fourth chips are ...