US Patent Issued to Kioxia on Aug. 26 for "Semiconductor manufacturing apparatus and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,995, issued on Aug. 26, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor manufacturing apparatus and method of manufacturing semiconductor device" was invented by Ai Mori (Yokkaichi Mie, Japan) and Hiroaki Ashidate (Mie Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a semiconductor manufacturing apparatus includes a magnification difference acquirer configured to acquire a value of difference in magnification between a first substrate and a second substrate. The apparatus further includes a deformation amount determiner configured to determine a value of deformation amount of a chuck that holds the first or second s...