ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,551, issued on April 22, was assigned to Kioxia Corp..
"Semiconductor device and manufacturing method thereof" was invented by Akihito Sawanobori (Yokkaichi Mie, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a semiconductor device includes a substrate; a semiconductor chip provided on the substrate; a resin covering the semiconductor chip; and a metal film provided on the resin. The metal film includes a first metal layer provided on the resin, a second metal layer provided on the first metal layer, and a third metal layer provided on the second metal layer. The first metal layer and the second metal layer contain ...