ALEXANDRIA, Va., June 5 -- United States Patent no. D1,070,863, issued on April 15, was assigned to KINGSTON DIGITAL INC. (Fountain Valley, Calif.).
"Heat sink for memory module" was invented by Hui-Hsin Lu (Hsinchu, Taiwan).
The patent was filed on Dec. 20, 2022, under Application No. D/863,507.
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