US Patent Issued to KIKUSUI SEISAKUSHO on Jan. 20 for "Powdery-material mixing degree measurement device and compression molding system" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,230, issued on Jan. 20, was assigned to KIKUSUI SEISAKUSHO LTD. (Kyoto, Japan).

"Powdery-material mixing degree measurement device and compression molding system" was invented by Shinsuke Fushimi (Kyoto, Japan), Hideyuki Nishimura (Kyoto, Japan) and Yuuya Kawai (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A powdery-material mixing degree measurement device includes a supplier configured to be fed with a mixed-powdery materials, a discharger configured to discharge to feed, with the mixed-powdery materials, a filling device configured to fill a die bore of the compression-molding machine with a powdery material, a rotator including a ...