US Patent Issued to Kepler Computing on Nov. 4 for "Method of forming capacitors through wafer bonding" (American, Belgian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,730, issued on Nov. 4, was assigned to Kepler Computing Inc. (San Francisco).

"Method of forming capacitors through wafer bonding" was invented by Biswajeet Guha (Hillsboro, Ore.), Mauricio Manfrini (Heverlee, Belgium), Noriyuki Sato (Palo Alto, Calif.), James David Clarkson (El Sobrante, Calif.), Abel Fernandez (Berkeley, Calif.), Somilkumar J. Rathi (San Jose, Calif.), Niloy Mukherjee (San Ramon, Calif.), Tanay Gosavi (Portland, Ore.), Amrita Mathuriya (Portland, Ore.), Rajeev Kumar Dokania (Beaverton, Ore.) and Sasikanth Manipatruni (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a device comprises forming a ...