US Patent Issued to Kepler Computing on March 4 for "3D stack of split graphics processing logic dies" (Oregon, California Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,797, issued on March 4, was assigned to Kepler Computing Inc. (San Francisco).

"3D stack of split graphics processing logic dies" was invented by Amrita Mathuriya (Portland, Ore.), Christopher B. Wilkerson (Portland, Ore.), Rajeev Kumar Dokania (Beaverton, Ore.), Debo Olaosebikan (San Francisco) and Sasikanth Manipatruni (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging technology to improve performance of an AI processing system resulting in an ultra-high bandwidth system. An IC package is provided which comprises: a substrate; a first die on the substrate, and a second die stacked over the first die. The first die can be a...